152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Features
152-Ball Package-on-Package (PoP) Combination Memory (TI OMAPTM) MT29C Family
Current production part numbers: See Table 1 on page 3
Features Micron® NAND Flash and Mobile LPDRAM components RoHS-compliant, "green" package Separate NAND Flash and Mobile LPDRAM interfaces Space-saving package-on-package combination Low-voltage operation (1.701.95V) Industrial temperature range: to +85°C Organization Page size x8: 2112 bytes + 64 bytes) x16: 1056 words + 32 words) Block size: 64 pages + 4K bytes) No external voltage reference required No minimum clock rate requirement 1.8V LVCMOS-compatible inputs Programmable burst lengths Partial-array self refresh (PASR) Deep power-down (DPD) mode Selectable output drive strength STATUS REGISTER READ (SRR) supported1 Options
Notes: 1. Contact factory for remapped SRR output. CL = CAS (READ) latency. Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2008 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications. 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Part Numbering Information 152-Ball PoP Micron NAND Flash and LPDRAM devices are available in different configurations and densities. Figure 2: 152-Ball Part Number Chart Blank = Production ES = Engineering sample MS = Mechanical sample
Type Width Density Generation CE#, CS# Chip Count
1 NAND, 1 DRAM 2 NAND, 1 DRAM 1 NAND, 2 DRAM 2 NAND, 2 DRAM
Not all possible combinations are available. Contact factory for availability.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Device Marking NAND Product MT46H16M32LFCM-6 IT LPDDR Product MT29F1G08ABCHC-ET MT29F1G16ABCHC-ET Physical Part Marking JW375 JW374 Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting a 5-digit alphanumeric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder. To view the location of the abbreviated mark on the device, refer to customer service note CSN-11, "Product Mark/Label," at www.micron.com/csn. | 
